Three-dimensional integrated circuits

Analysis of Planar Microstrip Circuits Using Three-Dimensional Transmission Line Matrix Method

The frequency-dependent characteristics of microstrip planar circuits have been previously analyzed using several full-wave approaches. All those methods directly give characteristic of the circuits frequency by frequency. Computation time becomes important if these planar circuits have to be studied over a very large bandwidth. The transmission line matrix (TLM) method presented in this paper ...

Efficient Analysis of Plasmonic circuits using Differential Global Surface Impedance (DGSI) Model

Differential global surface impedance (DGSI) model, a rigorous approach, has been applied to the analysis of three dimensional plasmonic circuits. This model gives a global relation between the tangential electric field and the equivalent surface electric current on the boundary of an object. This approach helps one bring the unknowns to the boundary surface of an object and so avoid volumetric...

Edgewise Compression Behavior of Three-Dimensional Integrated Woven Sandwich Composite Panels

Reliable clock and power delivery network design for three-dimensional integrated circuits

Numerical treatment of nonrectangular field-oxide for 3-D MOSFET simulation

This paper presents results of a new numerical treatment of 3D MOSFET simulation with nonplanar interfaces. The simulations have been carried out by MINIMOS 5 our fully three-dimensional simulation program. Three-dimensional effects like threshold shift for small channel devices , channel narrowing and the enhanced conductivity at the channel edge have been successfully modeled.

Efficient formulation and model-order reduction for the transient simulation of three-dimensional VLSI interconnect

Accurately accounting for three-dimensional (3-D) geometry and distributed RC effects in on-chip interconnect is important for predicting crosstalk in memory cells, analog circuits, and regions of congested routing in digital circuits. In this paper we describe a multipole-accelerated, mixed surfacevolume formulation, and a preconditioned model-order reduction algorithm for distributed RC, or e...